Process Capability: | |||
Process Capabilities | |||
Process Items | PRODUCTION CAPABILITIES | ||
2016 | 2017 | ||
Max. layers | 32 | 48 | |
Max. board thickness | 4.2mm | 5.6mm | |
Min. board thickness | 0. 4mm | 0.25mm | |
Basic copper thickness | Inner layer | 0.5 - 5oz | 0.5 - 7 oz |
Outer layer | 1/3 -6oz | 1/3 - 8oz | |
Hole size | Min blind hole | 0.1mm | 0.075mm |
Min buried hole | 0.2mm | 0.15mm | |
Min. Plated Through Hole（PTH） | 0.2mm | 0.15mm | |
Max aspect ratio(PTH) | ≤10:1 | ≤12:1 | |
Hole tolerance | PTH | +/-0.075mm | +/-0.05mm |
NPTH | +/-0.05mm | +/-0.04mm | |
Bow and twist | ≤0.5% | ≤0.4% | |
Mechanical tolerance of CNC | +/-0.05mm | +/-0.05mm | |
Mechanical tolerance of punching | +/-0.1mm | +/-0.075mm | |
Impedance tolerance | +/-10% | +/-8% | |
Min Trace L/S (Inner layer) | 0.05 / 0.05mm | 0.05 / 0.05mm | |
Min Trace L/S (outer layer) | 0.05 / 0.05mm | 0.05 / 0.05mm | |
Min BGA PAD | 0.18mm | 0.15mm | |
Min BGA Pitch | 0.4mm | 0.35mm | |
Shipping Array size | 460mm*540mm | 460mm*800mm | |
Special process | Long-short gold finger 、 sub-section gold finger 、high frequency board、 depth control drill、back drill、via filling、mechanical blind hole、 ELIC HDI | ||
Special product | LED、LCD、heavy copper PCB、Server、R&F、FPC、AL based PCB | ||
Production Capabilities | |||
Production content | Items | Production capacity | |
Material | Normal-Tg | GoWorld , KingBoard , NanYa | |
Medium –TG, High –Tg，Halogen Free | ITEQ , NanYa , TUC , ShengYi | ||
High frequency | NanYa , ISOLA, TUC , EMC | ||
Ceramic, Teflon, Aluminum , Special material | Rogers, ITEQ , TACONIC, Bergquist, Panasonic, HITACHI, Sumitomo | ||
Solder Mask | Screen printing | Green, Red, Yellow, Blue, Black,(Fog black, bright black ,coffee), White | |
Low pressure spraying | Green | ||
Solder mask ink supplier | Taiyo, Tamura, OTC, Rong Da, Unires | ||
Surface finishing | Gold finger plating | Gold thickness、Nickel thickness | Ni：2.50～5um，Au：0.125 〜0.75um |
Immersion silver | Silver thickness | AG：0.15um-0.5um | |
OSP | OSP thickness | 0.2 〜0.5um | |
Immersion gold | Gold thickness; | Ni：3～5um，Au：0.025 〜0.125um | |
Nickel thickness | |||
Immersion Tin | Tin thickness | Sn：1.0〜2um(40〜80u") | |
HASL | HASL(Lead Free ) | 2.5um-25um(100〜1000u") | |
Carbon | Carbon thickness | 20-40um | |
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| TEL:+086 0755 85241496 MB:+086 15014077679 |
FACTORY ADDRESS: HONGXING HAOYONG INDUSTRIAL ZONE, SONGGANG TOWN,BAOAN DISTRICT,SHENZHEN CITY, GUANGDONG PROVINCE,CHINA |
Business: alcantapcb@163.com pcbalcanta@vip.163.com Skype: henrychinasz |
